Micromachining lasers // MICRO

LS-MICRO-P

Picosecond micromachining laser

10 ps pulse width. Material leaves before it melts, so the cut face carries almost no heat-affected layer. Four wavelengths — IR 1064, green 532, UV 355 and DUV 266 nm — sort the materials.

1064 · 532 · 355 · 266 nm M² < 1.3 (DUV < 1.5)

Output

0.5 W ~ 75 W

Models

10 models

SPECIFICATIONS

Specifications

ItemValueUnitCondition
Average power0.5 ~ 75WSeries range
Output wavelength1064 · 532 · 355 · 266nm
Pulse width10psAll models
Repetition rate30 kHz ~ 3 MHzBy wavelength
Max. pulse energy20 ~ 500μJBy wavelength
Beam quality< 1.3 (DUV < 1.5)
Beam roundness≥ 90%
Power stability< 1 ~ 2% rmsBy wavelength
Beam divergence< 1mrad
CoolingWater-cooled, 25 ± 1 °C
Power supply220 single-phaseVAC
Operating ambient temp.20 ~ 30°C

MODELS

Models

ModelsWavelength (nm)Max. average power (W)
LS-MICRO-P-1064-30106430
LS-MICRO-P-1064-50106450
LS-MICRO-P-1064-75106475
LS-MICRO-P-532-1553215
LS-MICRO-P-532-3053230
LS-MICRO-P-355-2035520
LS-MICRO-P-266-0.52660.5
LS-MICRO-P-266-12661
LS-MICRO-P-266-22662
LS-MICRO-P-266-52665

CONTACT

For detailed specifications, please contact us below

info@lewssystem.co.kr